Semiconductor-at-speed testing for device characterization is designed to evaluate the future performance of devices while they are driven at near failure environmental conditions. In addition, semiconductor die manufacturers use burn-in to eliminate the early life failures from their lots. The temperature of the device in this process must be held constant for a significant period of time then switched as quickly as possible. Bulk TECs have been used to provide this rapid heating and cooling in the past but with most things the conditions for these tests are pushing the limits for both switching speeds and heat pumping capability.

Thin-film TECs have a larger heat pumping capability than standard bulk TECs but it is the superior switching speed of the devices that may ultimately prove to be their most valuable asset for this application. Recent measurements have shown that due to their smaller footprint and weight these thin-film TECs offer rapid switching that translates into more efficient use of energy for device characterization. In addition, the high heat flux of Nextreme's TECs enable direct cooling of today's high heat chips, eliminating the need for heat spreaders in the test system.

Nextreme Products for Semiconductor Test Systems

UPF40 - ideal for applications with high heat-flux requirements.  More >

HV14 - a high voltage, low current thermoelectric cooler optimized for standard circuitry and power requirements.  More >