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Nextreme is managed by an experienced start-up team and world-renowned experts in electronics, thermal management and pillar bump technology.
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Jim Mundell, MBA, Chief Operating Officer
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Jim Mundell is Chief Operating Officer of Nextreme. Previously he served as Senior Vice President & General Manager. He has 27 years of senior executive experience with P & L experience in semiconductor, microelectronics, medical devices and electronic systems manufacturing serving the computer, medical, military, and commercial markets. Jim has held executive positions such as COO, VP GM, and VP of International Operations with GE, Harris, CTS, SCI Systems, and various early stage technology companies such as CBA, Volumetrics Medical Imaging, and Trivirix International. Jim received his MS in Industrial Administration (MBA) from Purdue University's Krannert School of Management and his BS in Electrical Engineering Technology from Purdue University. |
Dave Koester, MS, Vice President of Engineering
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Dave Koester is VP of Engineering for Nextreme, Inc. Dave has over 15 years experience in semiconductor technology and product development focused primarily in the fabrication and manufacturing of semiconductors and microelectromechanical systems (MEMS). He has been responsible for product development in numerous areas including optical and wireless communications, biomedical device applications, and various sensing devices. Dave has held key technical and managerial positions with MCNC, Cronos Integrated Microsystems, JDS Uniphase, MEMSCAP, Inc. and RTI International. Dave received a MS from North Carolina State University in materials science and a BS from Iowa State University in ceramic engineering. |
Dr. Philip Deane, Vice President of Product Development
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Phil Deane has over twenty-five (25) years of experience in the development of packaging technology for semiconductor and photonic circuits to analyze thermal issues related to device and subsystem packaging. Phil received his B.A, M.S. and PhD in Physics all from the University of North Carolina. At AT&T Bell Laboratories Phil supported the multichip module business unit and was responsible for new process development, reliability and product qualification and transfer into manufacturing. Most recently at JDS Uniphase, he developed packaging solutions for laser diode and receivers components. Phil maintains an interest and expertise in solder and solder joint technology. He is the holder of six patents related to semiconductor and electronics packaging and has considerable thermal management expertise. |
Bill Charuk, Director of Sales
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Bill Charuk is the Director of Sales for Nextreme. Bill has over 20 years experience in sales management and business development of technology based products in various industries; including fiber optics, optical transmission systems, and semiconductor packaging. He has extensive domestic and international experience in direct, OEM and distribution sales channels into a wide range of markets. Bill has held sales and marketing management positions with Corning, IBM, JDS Uniphase and Amkor Technology (Unitive Electronics) prior to joining Nextreme. Bill received his BS degree from The Pennsylvania State University and is a veteran of the US Navy’s Nuclear Power program.
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Karl von Gunten, Director of Marketing
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Karl von Gunten is the Director of Marketing for Nextreme. With more than 25 years of experience in marketing and public relations, Karl brings a deep knowledge of products and trends to the communications business. Prior to joining Nextreme, Karl was director of business development, managing supervisor, at Gibbs & Soell Public Relations and vice president at Brodeur Worldwide, where he oversaw the regional office and managed PR efforts for industry leaders such as IBM, Nortel, Acterna, and Internet Security Systems. He serves as an adjunct professor for Duke University Pratt School of Engineering and holds a B.A. in Physics from Wittenberg University.
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